发明名称 LASER BEAM MACHINING APPARATUS AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a drilling apparatus that is free from large modification in movement of a focusing position of a laser optical system and in design target specifications. <P>SOLUTION: The apparatus is equipped with a lens 14 in which a plurality of laser beams emitted from a plurality of semiconductor laser elements 10a-10c are made incident in a light receiving face and in which a laser spot with the incident laser beams converged by a prescribed refractive characteristic is emitted to a workpiece, and is equipped with lenses 12a-12c in which an angle of incidence of the laser beam relative to the light receiving face of the lens 14 is deflected to an arbitrary angle for the emission. The lenses 12a-12c as a laser beam deflecting means deflect the outgoing angle of laser beams L<SB>01</SB>-L<SB>03</SB>so that the focusing positions of a plurality of laser spots S<SB>01</SB>-S<SB>03</SB>emitted from the lens 14 become a plurality of positions of different depth in the prescribed coordinate of the workpiece. Also, a controller 15 makes laser light emitting elements emit light in the order in which the focusing position of the laser spots S<SB>01</SB>-S<SB>03</SB>becomes deeper from the surface of the workpiece 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010120039(A) 申请公布日期 2010.06.03
申请号 JP20080294671 申请日期 2008.11.18
申请人 HITACHI COMPUTER PERIPHERALS CO LTD 发明人 SAHODA EIJI
分类号 B23K26/04;B23K26/073;B23K26/38 主分类号 B23K26/04
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