| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent molten solder overflowing from a land from being connected to the other non-equipotential land and a via without increasing an operation cost. Ž<P>SOLUTION: On one surface 2a of a substrate body 2 of a substrate 1, two diffusion preventing conductor patterns 6 forming a C-shape enclosing a land 3 in a non-contact manner at an outer circumference of each land 3, and furthermore, a C-shaped opening of the diffusion conductor pattern 6 is formed to face the direction of a via 5 forming the equipotential as the land 3 and to allow a potential equalization pattern 4 connected to the land 3 to pass through in a non-contact manner. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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