| 发明名称 |
Printed circuit board having metal bump and method of manufacring the same |
| 摘要 |
The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.
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| 申请公布号 |
US2010132985(A1) |
申请公布日期 |
2010.06.03 |
| 申请号 |
US20090379684 |
申请日期 |
2009.02.26 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG MYUNG SAM;PARK JEONG WOO;KIM OK TAE;YUN KIL YONG |
| 分类号 |
H05K1/09;H05K1/11;H05K3/20 |
主分类号 |
H05K1/09 |
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