| 摘要 |
Provided is a method for manufacturing a multilayer printed wiring board, wherein an excellent blind via is formed on an insulating layer at high productivity, in the case of using a prepreg for forming the insulating layer for the multilayer printed wiring board. The method for manufacturing the multilayer printed wiring board includes a step of forming the blind via by irradiating the insulating layer, which is formed by thermally curing the prepreg on the both surfaces or on one surface of a circuit board, with carbon dioxide gas laser from a plastic film adhered on the insulating layer surface. |
