SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A semiconductor device package and a method for manufacturing the same are provided to improve the electrical property and the reliability of the package by including a heat emission unit through a via. CONSTITUTION: A semiconductor chip(130) is formed on a wiring substrate(100). A bonding pad(140) is formed on the semiconductor chip. The semiconductor chip is molded with an encapsulating material. A via is formed in the encapsulating material. A heat transfer unit(170) is formed on the bonding pad. A heat emission unit(180) is formed on the heat transfer unit.