| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure that is free of interface peeling between an outer edge portion of a circuit board and a molding resin. <P>SOLUTION: An electrically-conductive adhesive 50 which has a lower elastic modulus than the circuit board 10 is arranged on the outer edge portion 11a of one surface 11 of the circuit board 10 as a stress reducing portion for reducing stress of the circuit board 10 received by the molding resin 40. The electrically-conductive adhesive 50 is covered by an adhesion improving member 60. When peeling stress is applied to the circuit board 10 from the molding resin 40, the electrically-conductive adhesive 50 and the adhesion improving member 60 receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board 10 is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT |
