发明名称 PACKAGE FOR ELECTRONIC COMPONENT, PIEZOELECTRIC DEVICE, AND METHOD FOR MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component package for arranging solid and spherical sealing materials in a sealing hole, and for air-tightly sealing an electronic component by melting the sealing materials, a piezoelectric device for achieving stable oscillation characteristics and high reliability by using the electronic component package, and a method for manufacturing the piezoelectric package. <P>SOLUTION: In a crystal oscillator 1 in which a crystal oscillation piece (25) is air-tightly sealed in an interior space formed of a lid substrate 10 and a base substrate, a sealing hole 40 formed in the lid substrate 10 as one substrate is configured as a through-path communicating an exterior side surface 11 of the lid substrate 10 with the concave bottom surface of the concave section 13 as an interior space side surface by communicating a hemispherical exterior side concave section 41 having an opening on the exterior side surface 11 and a curved surface extending in directions of penetration and inner periphery of the sealing hole 40 and an interior space side concave section 42 having an opening 42b at the interior space side via an opening 42a formed at the concave bottom section of the exterior side concave section 41, wherein a metallic film 43 is formed in an region including the inner wall of the exterior side concave section 41. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010124448(A) 申请公布日期 2010.06.03
申请号 JP20090120593 申请日期 2009.05.19
申请人 EPSON TOYOCOM CORP 发明人 SAIDA HIROYASU
分类号 H03H9/02;H01L23/02;H03H3/02 主分类号 H03H9/02
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