| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin-film multilayer wiring board in which less peeling occurs, and a method of manufacturing the same. Ž<P>SOLUTION: The thin-film multilayer wiring board includes a first SiO<SB>2</SB>thin film having at least one wiring layer formed on a lower wiring layer, an SiON thin film formed on the first SiO<SB>2</SB>thin film, a second SiO<SB>2</SB>thin film formed on the SiON thin film, a wiring conductor formed while buried in the second SiO<SB>2</SB>thin film, a via conductor connecting with the wiring conductor and penetrating the first SiO<SB>2</SB>thin film, SiON thin film, and second SiO<SB>2</SB>thin film to electrically connect with the wiring conductor of the lower wiring layer, and an SiN thin film formed on the second SiO<SB>2</SB>thin film. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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