| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component with simplified manufacturing processes, and to provide the electronic component. Ž<P>SOLUTION: The method includes a winding process wherein a flexible substrate made of a thermoplastic resin and provided with a wiring pattern thereon is subjected to thermocompression bonding while being wound on a winding core, so that the wiring pattern is wound around the winding core to form an electronic element. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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