| 摘要 |
An analysis apparatus for a printed circuit board includes a converting portion that rewrites physical property data of a wiring layer in contact with a mounting surface having the part corresponding to an extracted electronic part data to a value based on the physical property data of an electronic part, and converts the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of an insulating layer.
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