| 摘要 |
The present invention disclosed a heat-dissipating module for a light-emitting diode (LED), comprising:a LED substrate having a plurality of extending feet; a heat-dissipating device having a center portion; wherein the plurality of extending feet are bent downwards by an angel to be placed into the center portion so that the extending feet are tightly combined with the heat-dissipating device. A heat-dissipating apparatus for a light-emitting diode (LED) includes a heat-dissipating device, a LED substrate, a ring, and an electrically controlled carrier assembly. The heat-dissipating device has a hollow center potion. The LED substrate having a plurality of extending feet is bent downwards at an angle of 90 degrees. The LED substrate is placed into the hollow center potion of the heat-dissipating device so that the extending feet can be tightly combined with the heat-dissipating device. The electrically controlled carrier assembly is disposed in a lower half portion of the center potion of the heat-dissipating device, for driving at least one LED.
|
