METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MICROELECTRONIC MANUFACTURING TECHNIQUES

摘要

Bonding wires (252A) for sophisticated bonding applications may be efficiently formed on the basis of a corresponding template device (200) that may be formed on the basis of semiconductor material (201), such as silicon, in combination with associated fabrication techniques, such as lithography and etch techniques. Hence, any appropriate diameter and cross-sectional shape may be obtained with a high degree of accuracy and reliability.