| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device for efficiently removing mustache-like wastes generated from die attach films in cutting. SOLUTION: The cutting device includes: a chuck table T for holding a wafer W; a cutting means including a cutting blade 28 for cutting the wafer held by the chuck table; and a cutting feed means for relatively performing cutting feed of the chuck table and the cutting means in a cutting direction. A groove cleaning nozzle 33, which jets thread-like cleaning water 37 to a cutting groove 56 immediately after being cut by the cutting blade, is arranged in the cutting means. The cleaning water 37 jetted from the groove cleaning nozzle 33 removes the whisker-like wastes 58 generated by cutting the die attach film 29. COPYRIGHT: (C)2010,JPO&INPIT |
