| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package capable of increasing the density of a wiring pattern which can be led through a gap between exposed surfaces of bumps formed on respective electrode terminals in a plurality of semiconductor elements having different thicknesses and fixed to one surface of a support plate, and a method of manufacturing the semiconductor package. <P>SOLUTION: In the semiconductor package, a plurality of semiconductor elements 14a, 14b having different thicknesses are fixed to one surface of the support plate 10 through a resin layer 12 so that terminal surfaces of the electrode terminals 16 may be on the same level. A tapered bump 18 having a tip surface formed in a smaller area than an area of the terminal surface of the electrode terminal 16 of each of the semiconductor elements 14a, 14b is formed on the terminal surface of the electrode terminal so as to penetrate the insulating layer 20 for covering terminal formation sides of the semiconductor elements 14a, 14b, and the tip surface of the tapered bump 18 exposed to the surface of the insulating layer 20 is connected to the wiring pattern 22 formed on the surface of the insulating layer 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
