| 摘要 |
PROBLEM TO BE SOLVED: To improve the yield in a ball mount process by preventing slight adhesion and discoloration of solder balls, and to improve the soldering reliability of the solder balls by reducing an oxide film on a surface of the solder ball. SOLUTION: An organic compound having a cyclic structure and a chain hydrocarbon group is covered on a surface of the solder ball. COPYRIGHT: (C)2010,JPO&INPIT
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