| 摘要 |
A technology is provided for suppressing the occurrence of problems due to positional shift caused by temperature increase of a panel and a chassis, in a structure for mounting a driver IC chip and a driver module in a flat display device. The plasma display device is provided with a chassis section (63) arranged close to a panel (PDP) (64) and a rear surface side thereof; and a WB-ADM (address driver module) (61) having a flexible substrate (41) whereupon the driver IC chip (in a sealing resin (45)) for driving an electrode of the panel (64) is mounted by WB (wire bonding) method. The plasma display device is also provided with a buffer member (62) attached to the chassis section (63) to have a sliding mechanism and for fixing the WB-ADM (61).
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