| 摘要 |
PURPOSE: An apparatus for adjusting position of a wafer for AP CVD is provided to stabilize a range of vapor deposition thickness by automatically implementing a position adjustment of a wafer through the improved logic of a control device and compensating a wafer map. CONSTITUTION: A guard bar(11) is included in order to adhere closely an edge part of a wafer(1). A first driver(12) fixes the wafer to the guard bar and compensates a position of a wafer. A second driver(13) rotates the wafer. A rotary shaft(14) is connected to the second driver. A control device(15) transfers the position correction of the wafer and a rotating drive signal of the wafer to the first and second drivers.
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