| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC tag having sufficient adhesive strength even when reduced in size. <P>SOLUTION: The IC tag 10 is provided with: a body part 11 containing a compact inlet provided with an IC chip and a multi-layer antenna; and a flange 12 formed around one end of the main part 11. A surface 13 is formed by the body part 11 and the flange 12, and bonded to an object 100 to be adhered through a joint layer 200. The whole surface of the IC tag 10 including the bonding surface 13 is formed into a roughened surface S by embossing or the like. In addition, a recessed part 14 to be recessed on the side of the bonding surface 13 is formed at substantially the center of the bonding surface 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
