| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive solution excellent in storage stability of an adhesive composition comprising a nylon resin and an epoxy resin, and to provide an adhesive composition exhibiting a high adhesiveness to a polyimide film, excellent in solder heat resistance and preferably usable in FPC and excellent in storage stability. SOLUTION: The adhesive composition includes the solvent soluble nylon resin which is solid at 25°C, the epoxy resin and a novolac resin with a specific structure, wherein the nylon resin contains at least 20 mol% of piperazine with respect to 100 mol% of the total diamine components, and having an amine value of 1-6 (mg-KOH/g). COPYRIGHT: (C)2010,JPO&INPIT |
