发明名称 MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF-ALIGNED AIR GAPS BETWEEN CLOSELY SPACED METAL LINES
摘要 In sophisticated metallization systems, air gaps may be formed on the basis of a self-aligned patterning regime during which the conductive cap material of metal lines may be protected by providing one or more materials, which may subsequently be removed. Consequently, the etch behavior and the electrical characteristics of metal lines during the self-aligned patterning regime may be individually adjusted.
申请公布号 US2010133648(A1) 申请公布日期 2010.06.03
申请号 US20090604703 申请日期 2009.10.23
申请人 发明人 SEIDEL ROBERT;NOPPER MARKUS;PREUSSE AXEL
分类号 H01L29/06;H01L21/764 主分类号 H01L29/06
代理机构 代理人
主权项
地址