| 摘要 |
<p>The present invention relates to a square-cutting device for ingots. The square-cutting device enables an automatic, precise, and rapid square-cutting process that divides an ingot into plural cells prior to the slicing of the ingot for wafer fabrication. The invention comprises a supply carrier, a pair of transverse and longitudinal lift carriers, a screen, etc. The ingot is loaded on the supply carrier, and the supply carrier transports the loaded ingot to a portion located vertically below a cutting wire. The transverse and longitudinal lift carriers have plural cutting wires, and can ascend and descend on a vertical frame. The screen shows the worker information about the cutting state and position of the ingot. The invention is able to cut the ingot into plural cells at one time by moving up and down the transverse and longitudinal lift carriers including the plural cutting wires so that work efficiency and productivity may be increased. In addition, the worker is able to control each motor and device through a control unit by manipulating an operating panel, so work efficiency can be improved. Furthermore, the interval control operation of the cutting wire is simply and rapidly performed based on the information displayed by the screen such that more precise square-cutting may be implemented.</p> |
