HEAT SINK FOR SEMICONDUCTOR CHIP

摘要

PURPOSE: A heat sink for a semiconductor chip is provided to improve heat-emission efficiency by directly transmitting heat from a light emitting diode module to a pin regardless of a heat sink. CONSTITUTION: A heat sink(100) comprises a through hole(110) and a plurality of grooves(130). The grooves form a stepped part(120) on the upper side of the through hole. The width of the stepped part is as same as that of a loading part(410). The loading part is loaded on the stepped part. A protrusion(420) is formed to the longitudinal direction of the grooves. Pins(400) are fixed to the heat sink.