| 摘要 |
PURPOSE: A camera module formation method is provided to realize the minimized size of camera module by uniting a lens module on the top of the chip structure. CONSTITUTION: Housing structure(150a,150b,150c) is cut between lens structures(100a,100b,100c). A molding film is cut between chip packages(CP1,CP2,CP3). The chip structures(CS1,CS2,CS3) comprise the chip packages and molding patterns(MP1,MP2,MP3). The molding patterns surround the sidewall of the chip packages. Lens modules(LM1,LM2,LM3) are combined on the top of chip structures. A plurality of the camera modules(CM1,CM2,CM3) are formed. |
