| 摘要 |
<P>PROBLEM TO BE SOLVED: To securely supervise an undesired protrusion of wire from a bonding capillary by monitoring the presence of contact of a bonding wire and a semiconductor chip using a loop circuit when deceleration is started in the course of lowering the bonding capillary to a bonding pad. <P>SOLUTION: Wire bonding equipment monitors the presence of undesired contact of the wire and semiconductor chip using a loop circuit constituted by the wire and the like before the wire contacts a pad after deceleration is started in the course of lowering a capillary to the pad when a ball portion 7 of the leading end of the wire 6 is connected to the pad 5 on the semiconductor chip 1 using the capillary 31. <P>COPYRIGHT: (C)2010,JPO&INPIT |
