发明名称 METHOD FOR FORMING JOINED BODY AND JOINED BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for forming joined body firmly and efficiently joining two base materials with each other with high dimensional accuracy and under low temperature, and to provide a reliable joined body formed by firmly joining two base materials with each other with high dimensional accuracy. SOLUTION: The method for forming joined body includes a step of depositing joining films 31, 32 mainly made up of copper on a first substrate (base material) 21 and a second substrate (base material) 22 by using a chemical vapor deposition method, and a step of obtaining a joined body by bonding the joining films 31, 32 with each other by applying the compressive force between the first substrate 21 and the second substrate 22 while the first substrate 21 and the second substrate 22 are brought into contact with each other so that the joining films 31, 32 are opposite to each other. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010120088(A) 申请公布日期 2010.06.03
申请号 JP20090293507 申请日期 2009.12.24
申请人 SEIKO EPSON CORP 发明人 SATO MITSURU;YAMAMOTO TAKATOMO
分类号 B23K20/00;B23K20/16;B23K20/24;B23K101/36;B23K101/40;C23C14/14;C23C16/18;H01L21/02 主分类号 B23K20/00
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