| 摘要 |
According to one embodiment, an electronic device includes a housing, a printed circuit board, an electronic component, a bonding material, and chips. The printed circuit board is housed in the housing. The electronic component includes an electrode on a surface thereof that faces the printed circuit board. The bonding material is applied to at least part of the outer periphery of the electronic component on the printed circuit board to bond the electronic component to the printed circuit board. The chips are arranged at positions on the printed circuit board corresponding to the periphery of the surface of the electronic component to prevent the bonding material from intruding in a gap between the surface of the electronic component and the printed circuit board.
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