CARRIER FOR DOUBLE-SIDED POLISHING DEVICE, DOUBLE-SIDED POLISHING DEVICE USING THE SAME, AND DOUBLE-SIDED POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a carrier for a double-sided polishing device, reducing the generation of tapering on a polishing surface by suppressing the generation of outer peripheral sag due to the creep deformation of polishing cloth and making the wafer rotating on its axis during polishing, and improving the flatness of the wafer, and also to provide a double-sided polishing device and method using the same.

SOLUTION: The carrier for the double-sided polishing device in the double-sided polishing device polishing both sides of the wafer having a chamfering portion on a peripheral edge, is at least an integrally molded article arranged between upper and lower polishing plates on which the polishing cloth is pasted, and is provided with a holding hole for holding the wafer put between the upper and lower polishing plates during polishing. The carrier for the double-sided polishing device has a recessed groove on an inner periphery of the holding hole, and upper and lower tapered surfaces formed in the recessed groove and a wafer chamfering portion are contacted at a cross section point to hold the wafer.

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