| 摘要 |
PROBLEM TO BE SOLVED: To provide an individual circuit board for easily enabling the formation of a circuit pattern in each individual circuit board without forming a multilayer collective through hole, and the formation of a multilayer circuit board by the collective lamination of the individual circuit boards, and having the high reliability of mechanical and electrical connection at connecting parts, and to provide the multilayer circuit board formed by laminating them. SOLUTION: A conductive via-hole 5 penetrating the upper surface (main surface) and the lower surface (back surface) of an insulator layer of each circuit board is connected with a metal wiring pattern 7 at the main surface side, and a solder plate formation region 8 is formed at the metal wiring pattern 7. Moreover, the lower surface side of the conductive via-hole 5 has a projected projection structure, and a solder solid phase material layer 6 is formed on the surface of the projection structure. These individual circuit boards are laminated to manufacture a multilayer circuit board by a heating collective press. At this time, a plate of the solder plate formation region 8 and the solder solid phase material layer 6 on the surface of the conductive via hole 5 are solid-phase bonded to become rigid, thus securing the connection reliability at the bonded section. COPYRIGHT: (C)2010,JPO&INPIT |
