| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device containing a transformer in which miniaturization is achieved at low cost without using an on-chip micro-transformer. <P>SOLUTION: The semiconductor device includes: a semiconductor element 11 on the high-voltage circuit side; a semiconductor element 12 on the low-voltage circuit side; a planar coil 23 on the high-voltage circuit side, formed integrally with a lead frame on the high-voltage circuit side on a first plane parallel to the main surface of the lead frame on the high-voltage side supporting the semiconductor element 11 on the high-voltage circuit side with a predetermined interval; and a planar coil 24 on the low-voltage circuit side, formed integrally with a lead frame on the low-voltage circuit side not on the first plane but on a second plane parallel to the main surface of the lead frame on the low-voltage circuit side supporting the semiconductor element on the low-voltage circuit side with a predetermined interval, wherein the planar coil 23 on the high-voltage circuit side and the planar coil 24 on the low-voltage circuit side are arranged to overlap with each other on a planar view. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
