发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a high-performance semiconductor device which is less likely to have concentration of electric fields, can suppress a leakage current, can reduce an ineffective region in a PN junction region, can ensure a sufficient area for a Schottky junction region, and can be efficiently and easily manufactured. SOLUTION: In one face of an SiC semiconductor substrate 1 having a first conductivity type, a PN junction region 7a and a Schottky junction region 7b are formed. In the PN junction region 7a, a convex portion 2a having a trapezoidal cross-sectional shape, which includes a second conductivity type layer 2 formed on the semiconductor substrate 1, and a contact layer 3 formed on the second conductivity type layer 2 of the convex portion 2a in ohmic contact therewith are provided. A Schottky electrode 4 is formed continuous with the PN junction region 7a and the Schottky junction region 7b while covering the side face of the convex portion 2a and the contact layer 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010123741(A) 申请公布日期 2010.06.03
申请号 JP20080295826 申请日期 2008.11.19
申请人 SHOWA DENKO KK 发明人 SUGAI AKIHIKO
分类号 H01L29/47;H01L29/872 主分类号 H01L29/47
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