发明名称 PHENOL RESIN MOLDING MATERIAL AND PHENOL RESIN MOLDED ARTICLE
摘要 <p>Disclosed is a phenol resin molding material which has improved storage stability, kneading stability and moldability before curing, while exhibiting improved heat resistance, dimensional accuracy and dimensional stability after curing. The phenol resin molding material contains a novolac phenol resin, a polyvinyl acetate-modified novolac phenol resin, and a filler.  Silica is contained therein as the filler in an amount of 75-90% by mass relative to the total amount of the phenol resin molding material.</p>
申请公布号 WO2010061793(A1) 申请公布日期 2010.06.03
申请号 WO2009JP69714 申请日期 2009.11.20
申请人 PANASONIC ELECTRIC WORKS CO., LTD.;HIRABAYASHI, TATSUO;MIYOSHI, MASANORI 发明人 HIRABAYASHI, TATSUO;MIYOSHI, MASANORI
分类号 C08L61/14;C08K3/36 主分类号 C08L61/14
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