ADHESIVE FILM WITH ADHESION ENHANCING LAYER AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film and a method for manufacturing a circuit board capable of forming an insulating layer excellent in adhesion with a conductor layer without applying a special treating step of enhancing the adherence of the conductor layer with the insulating layer in manufacturing the circuit board. SOLUTION: The adhesive film with an adhesion enhancing layer wherein a hardening resin composition layer, and the adhesion enhancing layer with the conductor are laminated in this order is prepared and used for manufacturing the circuit board. COPYRIGHT: (C)2010,JPO&INPIT