| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate having a corrosion (discoloration) free inner conductor layer in a hollow part of a substrate body configured by laminating a plurality of ceramic layers and having a plating layer surely coating an outer conductor layer formed by being exposed to the surface of the substrate body or the lik, and to provide a method of manufacturing the same. SOLUTION: The wiring substrate K1 includes the substrate body 2 configured by laminating the plurality of ceramic layers s1-s6 and having a front surface 3, a back surface 4 and four outer wall surfaces 5a, 5b which are rectangular when viewed in plane, the hollow parts 6 formed inside the substrate body and formed in the intermediate ceramic layers s2-s4 except the uppermost ceramic layer s1, the lowermost ceramic layer s6 and the lower-layer-side ceramic layer s5 in the plurality of ceramic layers s1-s6, a single conductor layer 10 formed in a plane form on the front surface of the lower-layer-side ceramic layer s5 defining a floor surface 8 of the hollow part 5, and a plurality of through-holes h1 perforated between a ceiling surface 7 of the hollow part 5 and the front surface 3 of the substrate body 2. The through-holes h1 are filled with a filler made of a low-temperature sintered ceramic. COPYRIGHT: (C)2010,JPO&INPIT |
