发明名称 PRODUCTION OF A SELF-ALIGNED CUSIN BARRIER
摘要 A semiconductor product includes a portion made of copper, a portion made of a dielectric and a self-aligned barrier between the copper portion and the dielectric portion. The self-aligned barrier includes a first copper silicide layer comprising predominantly first copper silicide molecules, and a second copper silicide layer comprising predominantly second copper silicide molecules. The proportion of the number of silicon atoms is higher in the second silicide molecules than in the first silicide molecules. The second copper silicide layer is positioned between the copper portion and the first copper silicide layer. A nitride layer may overlie at least part of the first copper silicide layer.
申请公布号 US2010133634(A1) 申请公布日期 2010.06.03
申请号 US20100695782 申请日期 2010.01.28
申请人 STMICROELECTRONICS S.A. 发明人 CAUBET PIERRE;CASANOVA NICOLAS
分类号 H01L31/0232;H01L23/48 主分类号 H01L31/0232
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