发明名称 POLYAMIDE RESIN AND POLYAMIDE RESIN COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polyamide resin including pentamethylene diamine as a component, having a low melting point, excellent molding processability, and excellent melt retention stability while having a high glass transition temperature, and a composition thereof. <P>SOLUTION: The polyamide resin is obtained by a polycondensation of (A) pentamethylene diamine, (B) terephthalic acid and/or a derivative thereof, (C) at least one material selected from a lactam, an aminocarboxylic acid, and a 7C or more aliphatic dicarboxylic acid, the total of (A), (B), and (C) being 75 wt.% or more. The relative viscosity of a 98% sulfuric acid solution of the polyamide resin (polyamide resin: 0.01 g/mL) at 25°C is 1.5 to 4.0. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010121113(A) 申请公布日期 2010.06.03
申请号 JP20090233993 申请日期 2009.10.08
申请人 TORAY IND INC 发明人 AKITA MASARU;KATO KIMIYA;MATSUOKA HIDEO
分类号 C08G69/26;C08L77/10 主分类号 C08G69/26
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