| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for providing the layout of a pad for an inspection and wiring accompanying it, which makes it possible to inspect all the terminals of bare chips, in the semiconductor device wherein the bare chips are mounted in high density. <P>SOLUTION: For the semiconductor device, all the terminals of the bare chips are connected through a specified wiring layer inside a wiring board to the pad for the inspection disposed in a dummy region, and the dummy region is cut after the inspection is completed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
