| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dicing apparatus with the structure that prevents scratches from being generated on a worked front surface by a disk-shaped pressing portion, reduce variation in a processing position of blade, and control generation of chippings at a wafer's cut edge face. <P>SOLUTION: The dicing apparatus includes a rotatable blade 10 with a rotating shaft 12, which is for processing a workpiece (wafer 16), and a disk-shaped pressing portion rotatably supported at the rotating shaft 12 on both sides of the blade 10, and for rolling on the upper surface of the workpiece (wafer 16) independently together with the blade 10. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
