METHOD FOR THE PRODUCTION OF A MICROMECHANICAL COMPONENT, COMPONENT PRODUCED USING SAID METHOD, AND USE THEREOF

摘要

The invention relates to a method for producing a micromechanical component, the component produced using said method, and a use of the micromechanical component during the production of a micromechanical sensor component. In order to produce the micromechanical component, a first structured layer is first produced on the front side of a semiconductor wafer, and the semiconductor wafer is etched from the front side using a first trench etching step in accordance with said first structured layer. A second structured layer is then applied to the rear side of the semiconductor wafer, and the semiconductor wafer is etched from the rear side using a second trench etching step in accordance with the second structured layer. The invention is characterized in that a through-hole from the front side to the rear side is produced in the semiconductor wafer using the first and the second trench etching step.