发明名称 |
METHOD OF FORMING RELIEF STRUCTURES |
摘要 |
A method of forming a relief pattern on the surface of a substrate comprises the steps of providing a substrate, coating a thin layer of polymeric material onto the substrate, drying the polymeric material to leave residual lateral stress within the material, bringing a patterned stamp into contact with the polymeric material and applying pressure to the stamp such that the polymeric material ruptures patternwise and dewets at the surface of the substrate to form openings in the polymeric layer according to the pattern on the stamp.
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申请公布号 |
US2010133716(A1) |
申请公布日期 |
2010.06.03 |
申请号 |
US20090621608 |
申请日期 |
2009.11.19 |
申请人 |
WINKEL JURJEN F;HUCK WITHELMUS T;HE XIMIN |
发明人 |
WINKEL JURJEN F.;HUCK WITHELMUS T.;HE XIMIN |
分类号 |
B29C33/40;B05D3/06;B05D3/12 |
主分类号 |
B29C33/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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