发明名称 |
ON-CHIP COOLING SYSTEMS FOR INTEGRATED CIRCUITS |
摘要 |
Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.
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申请公布号 |
US2010136800(A1) |
申请公布日期 |
2010.06.03 |
申请号 |
US20100698370 |
申请日期 |
2010.02.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KUMAR KAUSHIK A.;MUNOZ ANDRES FERNANDO;SIEVERS MICHAEL RAY;WISE RICHARD STEPHEN |
分类号 |
H01L21/26 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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