A PROTECTION LIQUID FOR METAL SUBSTRATE OF SEMICONDUCTOR WAFER AND APPLICATION METHOD THEREOF

摘要

A protection liquid for metal substrate of semiconductor wafer is disclosed, which comprises: a star polymer with pigment-affinic groups, and water. The star polymer is one or more polymers of star polyacrylic acids, star polyacrylic esters and star polyacrylamides. A method of using the protection liquid includes: removing residues produced by plasma-etching or plasma-etching/ashing from semiconductor wafer with cleaning liquid, then rinsing the semiconductor wafer with the protection liquid, and drying it. The protection liquid is environmental friendly and can be prepared at low cost. The method can be operated easily and can significantly reduce the corrosion rate of aluminum to less than 2A/Min.