| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for polishing work, performing efficient and exact polishing work by controlling a film thickness of a metallic layer or an insulation layer formed on a substrate. <P>SOLUTION: The apparatus for polishing work is provided with: a polishing head 20 having a head body 21 and a retainer ring 23; and a surface plate 12 having the polishing pad 10. The retainer ring 23 is provided with a first electrode 26 coming into contact with the polishing pad 10, and the head body 21 is provided with a second electrode 27 bringing electrical conduction into a rear face of a substrate 40. A control part 32 is provided which monitors a conductivity between the first electrode 26 and the second electrode 27 through a conduction portion 43 for a film thickness monitor formed on the substrate 40 with electrical conduction brought into the substrate 40 and the substrate 40, detects a final-point position of polishing work based on the progress of the conductivity, and controls a film thickness of a film-formed layer 42 formed on the substrate 40, when performing polishing work with the substrate 40 supported by the polishing head 20. <P>COPYRIGHT: (C)2010,JPO&INPIT |
