发明名称 TEST FAIL ANALYSIS ON VLSI CHIPS
摘要 Compact graphical representations of common test fail signatures and process related test fails are provided through methods of selecting, calculating and/or presenting information. The input may be a list of failing tests on a sample of devices under test from chip and/or wafer process fails. The failing tests are identified and then other tests that fail at the same time may be identified. Several graphical outputs are provided, including all possible combinations between test fails and between test fails and process fails. The dependencies are printed as sorted two dimensional bitmaps that are compact representations of the results using color codes. Subtraction of two independent bitmaps is provided, which eliminates common properties and emphasizes differences between multiple bitmaps which allows for quick identification of differences of process fails potentially different between the two different bitmaps indicating potential root causes for the selected one of the test fails.
申请公布号 US2010135570(A1) 申请公布日期 2010.06.03
申请号 US20080326166 申请日期 2008.12.02
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ECKERT MARTIN;GOECKE GEORG;JUNGINGER MARTA;KEMPTER KLAUS;ULBRICHT MARKUS
分类号 G06K9/00 主分类号 G06K9/00
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