发明名称 MOISTURE-CURABLE HOT MELT ADHESIVE
摘要 <p>Disclosed is a moisture-curable hot melt adhesive that has an excellence balance in terms of environmental aspects, component compatibility, initial adhesion strength, heat resistance after moisture curing, and tack-free time, etc., further disclosed is a method for manufacturing said hot melt adhesive. This moisture-curable hot melt adhesive includes a urethane prepolymer having an isocyanate group on a terminal, and achieves the aforementioned excellent balance by including (A) a urethane modified rosin, with the residual ratio of the isocyanate compound being 5.0 mass% or less, and a heat-resistant softening temperature of 60°C or higher after moisture curing. The (A) urethane modified rosin can be obtained by a reaction between an isocyanate compound and a rosin derivative having a hydroxyl group, and the moisture-curable hot melt adhesive can be manufactured by mixing the (A) urethane modified rosin, polyol, and an isocyanate compound. This adhesive is particularly useful, for example, as a building material, an electronic material, or in the field of automobiles.</p>
申请公布号 WO2010061759(A1) 申请公布日期 2010.06.03
申请号 WO2009JP69534 申请日期 2009.11.18
申请人 HENKEL CORPORATION;TAMOGAMI, TSUYOSHI;YAMAKOSHI, HIDEYUKI 发明人 TAMOGAMI, TSUYOSHI;YAMAKOSHI, HIDEYUKI
分类号 C09J175/04;C09J193/04 主分类号 C09J175/04
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