发明名称 SYNCHRONOUS PULSE PLASMA ETCHING EQUIPMENT
摘要 PURPOSE: A synchronous pulse plasma etching machine is provided to provide a variety of operational mode by synchronizing a plurality of pulse modulated radio frequency(RF) power and applying the power to electrodes. CONSTITUTION: A first electrode(10) and a second electrode(20) generate plasma in a plasma etching chamber. A first RF power output unit(30) applies a first RF power with a first frequency and a first duty ratio to a first electrode. A second RF power output unit(40) applies a second RF power with a second frequency and a second duty ratio to a second electrode. A mode selection unit(50) outputs first selection signal and second selection signal. A bias controller(46) outputs a bias pulse signal. A bias mixer(44) outputs a pulse modulated RF bias power.
申请公布号 KR20100058346(A) 申请公布日期 2010.06.03
申请号 KR20080117111 申请日期 2008.11.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 TOKASHIKI KEN;CHO, HONG;CHOI, JEONG DONG
分类号 H01L21/3065;H05H1/24;H05H1/30 主分类号 H01L21/3065
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