发明名称 ETCHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an etching method for restraining the influence of heat to a body to be treated. Ž<P>SOLUTION: The etching method includes: a liquid arrangement process for disposing an etching liquid activated chemically by irradiation of light on the body to be treated; and a light irradiation process for applying the light to an interface between the body to be treated and the etching liquid. The body to be treated is etched by applying light to the etching liquid and chemically activating the etching liquid. The body to be etched is etched only by a chemical reaction, thus restraining the influence of heat to the body to be treated much more than a case for applying plasma. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010123611(A) 申请公布日期 2010.06.03
申请号 JP20080293375 申请日期 2008.11.17
申请人 SEIKO EPSON CORP 发明人 SAIBA KOJI
分类号 H01L21/306 主分类号 H01L21/306
代理机构 代理人
主权项
地址