SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to electronically connect semiconductor chips without additional bumps by simultaneously forming a conductive stud bump and a penetration silicone via on a wafer level chip. CONSTITUTION: An insulating layer(14) is attached to the upper and lower sides of a wafer level semiconductor chip(10). A plurality of first via holes(16) is formed on the insulating layer. A plurality of second via holes(18) is formed by penetrating the semiconductor chip. A conductive stud bump(20) is formed by coagulating the conductive metallic material which is charged in the first and second via holes. The sectional areas of the first via-holes are larger than those of the second via holes.