发明名称 WAFER PROCESSING APPARATUS AND MAINTENANCE METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a wafer processing system capable of assuring maintenance space. SOLUTION: A wafer processing apparatus includes a chamber containing an internal space, a processing unit which is installed in the internal space of the chamber, can be drawn out through one surface of the chamber, and is provided with an exhaust line, and an exhaust member installed in the chamber. The exhaust member is connected to the exhaust line and is so provided as to move along with the movement of the processing unit. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010123964(A) 申请公布日期 2010.06.03
申请号 JP20090262053 申请日期 2009.11.17
申请人 SEMES CO LTD 发明人 NO HYONRE
分类号 H01L21/027;H01L21/677 主分类号 H01L21/027
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