| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillation device wherein a bad effect due to foreign matters or sealing gas at the time of hermetic sealing is eliminated to reduce the effect of stress of a conductive bump. Ž<P>SOLUTION: The piezoelectric oscillation device includes a piezoelectric oscillation piece 2 having an oscillation part 23 and a holding part 24, a base 3 which holds the piezoelectric oscillation piece, and a lid 4 which is joined at the sealing part of the base for hermetically sealing the piezoelectric oscillation piece held by the base. The holding part of the piezoelectric oscillation piece is joined by ultrasonic waves to a mounting part of the base using a conductive bump B. A shield plate 5 is interposed between an oscillation part 23 of the piezoelectric oscillation piece and a sealing part 321 of the base. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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