| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a method of cleaning a wafer capable of preventing generation of a watermark on a wafer surface in a wafer cleaning process; and a method of manufacturing a semiconductor device. Ž<P>SOLUTION: In this method of cleaning the wafer, a semiconductor wafer is cleaned by being immersed in a cleaning liquid. In the method of cleaning a wafer, an angle formed by a long-side direction of a product chip 10 region of the semiconductor wafer 17 and a liquid surface of the cleaning liquid 16 is kept within 3°, and the semiconductor wafer 17 is immersed in the cleaning liquid 16 while keeping the angle formed by the surface of the semiconductor wafer 17 and the liquid surface of the cleaning liquid 16 within 3°. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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